Chamber with flow-through source

ABSTRACT

Described processing chambers may include a chamber housing at least partially defining an interior region of a semiconductor processing chamber. The chamber may include a showerhead positioned within the chamber housing, and the showerhead may at least partially divide the interior region into a remote region and a processing region in which a substrate can be contained. The chamber may also include an inductively coupled plasma source positioned between the showerhead and the processing region. The inductively coupled plasma source may include a conductive material within a dielectric material.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. application Ser. No. 15/285,176, filed Oct. 4, 2016, and which is hereby incorporated by reference in its entirety for all purposes.

TECHNICAL FIELD

The present technology relates to semiconductor systems, processes, and equipment. More specifically, the present technology relates to processing chambers that may include an inductively coupled plasma source within the chamber.

BACKGROUND

Integrated circuits are made possible by processes which produce intricately patterned material layers on substrate surfaces. Producing patterned material on a substrate requires controlled methods for removal of exposed material. Chemical etching is used for a variety of purposes including transferring a pattern in photoresist into underlying layers, thinning layers, or thinning lateral dimensions of features already present on the surface. Often it is desirable to have an etch process that etches one material faster than another facilitating, for example, a pattern transfer process. Such an etch process is said to be selective to the first material. As a result of the diversity of materials, circuits, and processes, etch processes have been developed with a selectivity towards a variety of materials.

Etch processes may be termed wet or dry based on the materials used in the process. A wet HF etch preferentially removes silicon oxide over other dielectrics and materials. However, wet processes may have difficulty penetrating some constrained trenches and also may sometimes deform the remaining material. Dry etches produced in local plasmas formed within the substrate processing region can penetrate more constrained trenches and exhibit less deformation of delicate remaining structures. However, local plasmas may damage the substrate through the production of electric arcs as they discharge.

Thus, there is a need for improved systems and methods that can be used to produce high quality devices and structures. These and other needs are addressed by the present technology.

SUMMARY

Semiconductor processing systems and methods of the present technology may include semiconductor processing chambers including a chamber housing at least partially defining an interior region of a semiconductor processing chamber. The chamber may include a showerhead positioned within the chamber housing, and the showerhead may at least partially divide the interior region into a remote region and a processing region in which a substrate can be contained. The chamber may also include an inductively coupled plasma source positioned between the showerhead and the processing region. The inductively coupled plasma source may include a conductive material within a dielectric material.

In embodiments the dielectric material may be selected from the group consisting of aluminum oxide, yttrium oxide, single crystalline silicon, and quartz. Additionally, the conductive material may include a copper tube configured to receive a fluid flowed within the tube. The dielectric material may define apertures through the inductively coupled plasma source. In some embodiments the conductive material may be positioned about the apertures within the dielectric material. The apertures may be included in a uniform pattern across the dielectric material and about the conductive material. In some embodiments, the conductive material may be configured in a planar spiral pattern within the dielectric material. In other embodiments the conductive material may configured in a coil extending vertically within the dielectric material for at least two complete turns of the conductive material.

In exemplary plasma sources, the conductive material may include two conductive tubes positioned within the inductively coupled source. A first tube may be included in a first configuration within the inductively coupled source, and a second tube may be included in a second configuration within the inductively coupled source. In some embodiments the second configuration may be radially inward of the first configuration. The first configuration and the second configuration may each be coiled configurations extending vertically within the dielectric material. In other embodiments, the first configuration and the second configuration may each be a planar configuration within the same plane of the inductively coupled source. The first tube and the second tube may be coupled with an RF source, and in some embodiments the first tube and the second tube may each be coupled with the RF source through a capacitive divider. Additionally, in some embodiments the inductively coupled source may include at least two plates coupled together. Each plate of the at least two plates may define at least a portion of a channel, and the conductive material may be housed within the channel at least partially defined by each of the at least two plates.

The present technology also encompasses inductively coupled plasma sources. Exemplary sources may include a first plate defining at least a portion of a channel within the first plate. The first plate may include a dielectric material, for example. Exemplary sources may also include a conductive material seated within the at least a portion of the channel. In some embodiments the conductive material may be characterized by a spiral or coil configuration. Additionally, the conductive material may be coupled with an RF source and configured to generate a plasma across the source.

In some exemplary sources the first plate may define apertures through the first plate, and a central axis of each aperture may be normal to the at least a portion of the channel. In embodiments the source may be characterized by a thickness of at least three inches. The first plate may define at least a portion of the first channel and at least a portion of a second channel in embodiments. The conductive material may include at least a first conductive material seated within the at least a portion of the first channel and a second conductive material seated within the at least a portion of the second channel. Exemplary sources may further include a second plate coupled with the first plate enclosing the conductive material between the first plate and the second plate. In embodiments the second plate may define second apertures axially aligned with the apertures defined through the first plate.

The present technology additionally includes semiconductor processing chambers. Exemplary chambers may include a chamber housing at least partially defining an interior region of the semiconductor processing chamber. The chamber housing may include a lid assembly including an inlet for receiving precursors into the semiconductor processing chamber. The chambers may also include a pedestal within the interior region of the semiconductor processing chamber. The chambers may include a showerhead positioned within the chamber housing. In embodiments, the showerhead may be positioned between the lid assembly and the pedestal. Additionally, the chambers may include an inductively coupled plasma source positioned between the showerhead and the pedestal. The inductively coupled plasma source may include a conductive material within a dielectric material.

Such technology may provide numerous benefits over conventional systems and techniques. For example, inductive sources according to the present technology may reduce component sputtering from the electrodes. Additionally, plasma sources of the present technology may allow decoupling of plasma ion energy from ion density. These and other embodiments, along with many of their advantages and features, are described in more detail in conjunction with the below description and attached figures.

BRIEF DESCRIPTION OF THE DRAWINGS

A further understanding of the nature and advantages of the disclosed technology may be realized by reference to the remaining portions of the specification and the drawings.

FIG. 1 shows a top plan view of an exemplary processing system according to embodiments of the present technology.

FIG. 2 shows a schematic cross-sectional view of an exemplary processing chamber according to embodiments of the present technology.

FIG. 3 shows a bottom plan view of an exemplary showerhead according to embodiments of the disclosed technology.

FIG. 4 shows a plan view of an exemplary faceplate according to embodiments of the disclosed technology.

FIG. 5 shows a cross-sectional view of a processing chamber according to embodiments of the present technology.

FIG. 6 shows a plan view of an exemplary plasma source according to embodiments of the present technology.

FIG. 7 shows a cross-sectional view of the exemplary plasma source of FIG. 6 according to embodiments of the present technology.

FIG. 8 shows a plan view of an exemplary plasma source according to embodiments of the present technology.

FIG. 9 shows a plan view of an exemplary plasma source according to embodiments of the present technology.

FIG. 10 shows a cross-sectional view of a processing chamber according to embodiments of the present technology.

FIG. 11 shows a plan view of an exemplary plasma source according to embodiments of the present technology.

FIG. 12 shows a cross-sectional view of the exemplary plasma source of FIG. 11 according to embodiments of the present technology.

FIG. 13 shows operations of an exemplary method according to embodiments of the present technology.

Several of the figures are included as schematics. It is to be understood that the figures are for illustrative purposes, and are not to be considered of scale unless specifically stated to be of scale. Additionally, as schematics, the figures are provided to aid comprehension and may not include all aspects or information compared to realistic representations, and may include additional or exaggerated material for illustrative purposes.

In the appended figures, similar components and/or features may have the same reference label. Further, various components of the same type may be distinguished by following the reference label by a letter that distinguishes among the similar components. If only the first reference label is used in the specification, the description is applicable to any one of the similar components having the same first reference label irrespective of the letter.

DETAILED DESCRIPTION

The present technology includes systems and components for semiconductor processing including tuned etch processes. Certain processing chambers available may include multiple plasma mechanisms, such as one at the wafer level as well as a remote plasma source. Plasma at the wafer level may often be formed via a capacitively-coupled plasma formed between two electrodes. One or both of these electrodes may be or include additional chamber components, such as showerheads, pedestals, or chamber walls. However, even at relatively low level plasma power and chamber pressures, such as 50 W power at 20 mTorr, the induced voltage on the electrodes may be hundreds of volts. This may cause sputtering of the electrodes themselves, which may introduce the sputtered particulate material onto the wafer. These particulates may fail to allow uniformity across the wafer, and may deposit conductive material that can cause short circuiting of the finally produced circuit.

Conventional technologies may have addressed this sputtering issue by seasoning the chamber components with a polymer coating, such as a carbon-containing coating or a silicon-containing coating. Such a polymer layer may operate as a passivation layer on the surfaces of the capacitively-coupled source electrodes. However, such a coating may be difficult to apply uniformly to a showerhead or component, may not have complete coverage, and may still be degraded over time leading to the polymeric material being deposited on the wafer.

The present technology may overcome these issues by utilizing an inductively-coupled plasma (“ICP”) source within the chamber itself. The ICP source may produce voltages much lower than a capacitively-coupled plasma source of the same power, which may at least partially resolve electrode sputtering. Additionally, because the ICP source operates differently from the two plates of the capacitively-coupled source, plasma ion density and ion energy may be decoupled in exemplary chambers according to the present technology. This may allow improved plasma tuning and feature modification over conventional technologies.

Although the remaining disclosure will routinely identify specific etching processes utilizing the disclosed technology, it will be readily understood that the systems and methods are equally applicable to deposition and cleaning processes as may occur in the described chambers. Accordingly, the technology should not be considered to be so limited as for use with etching processes alone.

FIG. 1 shows a top plan view of one embodiment of a processing system 100 of deposition, etching, baking, and curing chambers according to embodiments. The processing tool 100 depicted in FIG. 1 may contain a plurality of process chambers, 114A-D, a transfer chamber 110, a service chamber 116, an integrated metrology chamber 117, and a pair of load lock chambers 106A-B. The process chambers may include structures or components similar to those described in relation to FIG. 2, as well as additional processing chambers.

To transport substrates among the chambers, the transfer chamber 110 may contain a robotic transport mechanism 113. The transport mechanism 113 may have a pair of substrate transport blades 113A attached to the distal ends of extendible arms 113B, respectively. The blades 113A may be used for carrying individual substrates to and from the process chambers. In operation, one of the substrate transport blades such as blade 113A of the transport mechanism 113 may retrieve a substrate W from one of the load lock chambers such as chambers 106A-B and carry substrate W to a first stage of processing, for example, an etching process as described below in chambers 114A-D. If the chamber is occupied, the robot may wait until the processing is complete and then remove the processed substrate from the chamber with one blade 113A and may insert a new substrate with a second blade (not shown). Once the substrate is processed, it may then be moved to a second stage of processing. For each move, the transport mechanism 113 generally may have one blade carrying a substrate and one blade empty to execute a substrate exchange. The transport mechanism 113 may wait at each chamber until an exchange can be accomplished.

Once processing is complete within the process chambers, the transport mechanism 113 may move the substrate W from the last process chamber and transport the substrate W to a cassette within the load lock chambers 106A-B. From the load lock chambers 106A-B, the substrate may move into a factory interface 104. The factory interface 104 generally may operate to transfer substrates between pod loaders 105A-D in an atmospheric pressure clean environment and the load lock chambers 106A-B. The clean environment in factory interface 104 may be generally provided through air filtration processes, such as HEPA filtration, for example. Factory interface 104 may also include a substrate orienter/aligner (not shown) that may be used to properly align the substrates prior to processing. At least one substrate robot, such as robots 108A-B, may be positioned in factory interface 104 to transport substrates between various positions/locations within factory interface 104 and to other locations in communication therewith. Robots 108A-B may be configured to travel along a track system within enclosure 104 from a first end to a second end of the factory interface 104.

The processing system 100 may further include an integrated metrology chamber 117 to provide control signals, which may provide adaptive control over any of the processes being performed in the processing chambers. The integrated metrology chamber 117 may include any of a variety of metrological devices to measure various film properties, such as thickness, roughness, composition, and the metrology devices may further be capable of characterizing grating parameters such as critical dimensions, sidewall angle, and feature height under vacuum in an automated manner.

Turning now to FIG. 2 is shown a cross-sectional view of an exemplary process chamber system 200 according to the present technology. Chamber 200 may be used, for example, in one or more of the processing chamber sections 114 of the system 100 previously discussed. Generally, the etch chamber 200 may include a first capacitively-coupled plasma source to implement an ion milling operation and a second capacitively-coupled plasma source to implement an etching operation and to implement an optional deposition operation. In embodiments explained further below, the chamber may further include an inductively-coupled plasma source to perform additional ion etching operations. The chamber 200 may include grounded chamber walls 240 surrounding a chuck 250. In embodiments, the chuck 250 may be an electrostatic chuck that clamps the substrate 202 to a top surface of the chuck 250 during processing, though other clamping mechanisms as would be known may also be utilized. The chuck 250 may include an embedded heat exchanger coil 217. In the exemplary embodiment, the heat exchanger coil 217 includes one or more heat transfer fluid channels through which heat transfer fluid, such as an ethylene glycol/water mix, may be passed to control the temperature of the chuck 250 and ultimately the temperature of the substrate 202.

The chuck 250 may include a mesh 249 coupled to a high voltage DC supply 248 so that the mesh 249 may carry a DC bias potential to implement the electrostatic clamping of the substrate 202. The chuck 250 may be coupled with a first RF power source and in one such embodiment, the mesh 249 may be coupled with the first RF power source so that both the DC voltage offset and the RF voltage potentials are coupled across a thin dielectric layer on the top surface of the chuck 250. In the illustrative embodiment, the first RF power source may include a first and second RF generator 252, 253. The RF generators 252, 253 may operate at any industrially utilized frequency, however in the exemplary embodiment the RF generator 252 may operate at 60 MHz to provide advantageous directionality. Where a second RF generator 253 is also provided, the exemplary frequency may be 2 MHz.

With the chuck 250 to be RF powered, an RF return path may be provided by a first showerhead 225, which may include a dual channel showerhead. The first showerhead 225 may be disposed above the chuck to distribute a first feed gas into a first chamber region 284 defined by the first showerhead 225 and the chamber wall 240. As such, the chuck 250 and the first showerhead 225 form a first RF coupled electrode pair to capacitively energize a first plasma 270 of a first feed gas within a first chamber region 284. A DC plasma bias, or RF bias, resulting from capacitive coupling of the RF powered chuck may generate an ion flux from the first plasma 270 to the substrate 202, e.g., Ar ions where the first feed gas is Ar, to provide an ion milling plasma. The first showerhead 225 may be grounded or alternately coupled with an RF source 228 having one or more generators operable at a frequency other than that of the chuck 250, e.g., 13.56 MHz or 60 MHz. In the illustrated embodiment the first showerhead 225 may be selectably coupled to ground or the RF source 228 through the relay 227 which may be automatically controlled during the etch process, for example by a controller (not shown). In disclosed embodiments, chamber 200 may not include showerhead 225 or dielectric spacer 220, and may instead include only baffle 215 and showerhead 210 described further below.

As further illustrated in the figure, the etch chamber 200 may include a pump stack capable of high throughput at low process pressures. In embodiments, at least one turbo molecular pump 265, 266 may be coupled with the first chamber region 284 through one or more gate valves 260 and disposed below the chuck 250, opposite the first showerhead 225. The turbo molecular pumps 265, 266 may be any commercially available pumps having suitable throughput and more particularly may be sized appropriately to maintain process pressures below or about 10 mTorr or below or about 5 mTorr at the desired flow rate of the first feed gas, e.g., 50 to 500 sccm of Ar where argon is the first feedgas. In the embodiment illustrated, the chuck 250 may form part of a pedestal which is centered between the two turbo pumps 265 and 266, however in alternate configurations chuck 250 may be on a pedestal cantilevered from the chamber wall 240 with a single turbo molecular pump having a center aligned with a center of the chuck 250.

Disposed above the first showerhead 225 may be a second showerhead 210. In one embodiment, during processing, the first feed gas source, for example, Argon delivered from gas distribution system 290 may be coupled with a gas inlet 276, and the first feed gas flowed through a plurality of apertures 280 extending through second showerhead 210, into the second chamber region 281, and through a plurality of apertures 282 extending through the first showerhead 225 into the first chamber region 284. An additional flow distributor or baffle 215 having apertures 278 may further distribute a first feed gas flow 216 across the diameter of the etch chamber 200 through a distribution region 218. In an alternate embodiment, the first feed gas may be flowed directly into the first chamber region 284 via apertures 283 which are isolated from the second chamber region 281 as denoted by dashed line 223.

Chamber 200 may additionally be reconfigured from the state illustrated to perform an etching operation. A secondary electrode 205 may be disposed above the first showerhead 225 with a second chamber region 281 there between. The secondary electrode 205 may further form a lid or top plate of the etch chamber 200. The secondary electrode 205 and the first showerhead 225 may be electrically isolated by a dielectric ring 220 and form a second RF coupled electrode pair to capacitively discharge a second plasma 292 of a second feed gas within the second chamber region 281. Advantageously, the second plasma 292 may not provide a significant RF bias potential on the chuck 250. At least one electrode of the second RF coupled electrode pair may be coupled with an RF source for energizing an etching plasma. The secondary electrode 205 may be electrically coupled with the second showerhead 210. In an exemplary embodiment, the first showerhead 225 may be coupled with a ground plane or floating and may be coupled to ground through a relay 227 allowing the first showerhead 225 to also be powered by the RF power source 228 during the ion milling mode of operation. Where the first showerhead 225 is grounded, an RF power source 208, having one or more RF generators operating at 13.56 MHz or 60 MHz, for example, may be coupled with the secondary electrode 205 through a relay 207 which may allow the secondary electrode 205 to also be grounded during other operational modes, such as during an ion milling operation, although the secondary electrode 205 may also be left floating if the first showerhead 225 is powered.

A second feed gas source, such as nitrogen trifluoride, and a hydrogen source, such as ammonia, may be delivered from gas distribution system 290, and coupled with the gas inlet 276 such as via dashed line 224. In this mode, the second feed gas may flow through the second showerhead 210 and may be energized in the second chamber region 281. Reactive species may then pass into the first chamber region 284 to react with the substrate 202. As further illustrated, for embodiments where the first showerhead 225 is a multi-channel showerhead, one or more feed gases may be provided to react with the reactive species generated by the second plasma 292. In one such embodiment, a water source may be coupled with the plurality of apertures 283. Additional configurations may also be based on the general illustration provided, but with various components reconfigured. For example, flow distributor or baffle 215 may be a plate similar to the second showerhead 210, and may be positioned between the secondary electrode 205 and the second showerhead 210.

As any of these plates may operate as an electrode in various configurations for producing plasma, one or more annular or other shaped spacer may be positioned between one or more of these components, similar to dielectric ring 220. Second showerhead 210 may also operate as an ion suppression plate in embodiments, and may be configured to reduce, limit, or suppress the flow of ionic species through the second showerhead 210, while still allowing the flow of neutral and radical species. One or more additional showerheads or distributors may be included in the chamber between first showerhead 225 and chuck 250. Such a showerhead may take the shape or structure of any of the distribution plates or structures previously described. Also, in embodiments a remote plasma unit (not shown) may be coupled with the gas inlet to provide plasma effluents to the chamber for use in various processes.

In an embodiment, the chuck 250 may be movable along the distance H2 in a direction normal to the first showerhead 225. The chuck 250 may be on an actuated mechanism surrounded by a bellows 255, or the like, to allow the chuck 250 to move closer to or farther from the first showerhead 225 as a means of controlling heat transfer between the chuck 250 and the first showerhead 225, which may be at an elevated temperature of 80° C.-150° C., or more. As such, an etch process may be implemented by moving the chuck 250 between first and second predetermined positions relative to the first showerhead 225. Alternatively, the chuck 250 may include a lifter 251 to elevate the substrate 202 off a top surface of the chuck 250 by distance H1 to control heating by the first showerhead 225 during the etch process. In other embodiments, where the etch process is performed at a fixed temperature such as about 90-110° C. for example, chuck displacement mechanisms may be avoided. A system controller (not shown) may alternately energize the first and second plasmas 270 and 292 during the etching process by alternately powering the first and second RF coupled electrode pairs automatically.

The chamber 200 may also be reconfigured to perform a deposition operation. A plasma 292 may be generated in the second chamber region 281 by an RF discharge which may be implemented in any of the manners described for the second plasma 292. Where the first showerhead 225 is powered to generate the plasma 292 during a deposition, the first showerhead 225 may be isolated from a grounded chamber wall 240 by a dielectric spacer 230 so as to be electrically floating relative to the chamber wall. In the exemplary embodiment, an oxidizer feed gas source, such as molecular oxygen, may be delivered from gas distribution system 290, and coupled with the gas inlet 276. In embodiments where the first showerhead 225 is a multi-channel showerhead, any silicon-containing precursor, such as OMCTS for example, may be delivered from gas distribution system 290, and directed into the first chamber region 284 to react with reactive species passing through the first showerhead 225 from the plasma 292. Alternatively the silicon-containing precursor may also be flowed through the gas inlet 276 along with the oxidizer. Chamber 200 is included as a general chamber configuration that may be utilized for various operations discussed in reference to the present technology.

FIG. 3 is a bottom view of a showerhead 325 for use with a processing chamber according to embodiments. Showerhead 325 may correspond with showerhead 225 shown in FIG. 2. Through-holes 365, which may be a view of first fluid channels or apertures 282, may have a plurality of shapes and configurations in order to control and affect the flow of precursors through the showerhead 225. Small holes 375, which may be a view of second fluid channels or apertures 283, may be distributed substantially evenly over the surface of the showerhead, even amongst the through-holes 365, and may provide more even mixing of the precursors as they exit the showerhead than other configurations.

An arrangement for a faceplate according to embodiments is shown in FIG. 4. As shown, the faceplate 400 may include a perforated plate or manifold. The assembly of the faceplate may be similar to the showerhead as shown in FIG. 3, or may include a design configured specifically for distribution patterns of precursor gases. Faceplate 400 may include an annular frame 410 positioned in various arrangements within an exemplary processing chamber, such as the chamber as shown in FIG. 2. On or within the frame may be coupled a plate 420, which may be similar in embodiments to ion suppressor plate 523 as described below. In embodiments faceplate 400 may be a single-piece design where the frame 410 and plate 420 are a single piece of material.

The plate may have a disc shape and be seated on or within the frame 410. The plate may be a conductive material such as a metal including aluminum, as well as other conductive materials that allow the plate to serve as an electrode for use in a plasma arrangement as previously described. The plate may be of a variety of thicknesses, and may include a plurality of apertures 465 defined within the plate. An exemplary arrangement as shown in FIG. 4 may include a pattern as previously described with reference to the arrangement in FIG. 3, and may include a series of rings of apertures in a geometric pattern, such as a hexagon as shown. As would be understood, the pattern illustrated is exemplary and it is to be understood that a variety of patterns, hole arrangements, and hole spacing are encompassed in the design.

The apertures 465 may be sized or otherwise configured to allow fluids to be flowed through the apertures during operation. The apertures may be sized less than about 2 inches in various embodiments, and may be less than or about 1.5 inches, about 1 inch, about 0.9 inches, about 0.8 inches, about 0.75 inches, about 0.7 inches, about 0.65 inches, about 0.6 inches, about 0.55 inches, about 0.5 inches, about 0.45 inches, about 0.4 inches, about 0.35 inches, about 0.3 inches, about 0.25 inches, about 0.2 inches, about 0.15 inches, about 0.1 inches, about 0.05 inches, about 0.04 inches, about 0.035 inches, about 0.03 inches, about 0.025 inches, about 0.02 inches, about 0.015 inches, about 0.01 inches, etc. or less.

In some embodiments faceplate 400 may operate as an ion suppressor that defines a plurality of apertures throughout the structure that are configured to suppress the migration of ionically-charged species out of a chamber plasma region while allowing uncharged neutral or radical species to pass through the ion suppressor into an activated gas delivery region downstream of the ion suppressor. In embodiments, the ion suppressor may be a perforated plate with a variety of aperture configurations. These uncharged species may include highly reactive species that are transported with less reactive carrier gas through the apertures. As noted above, the migration of ionic species through the holes may be reduced, and in some instances completely suppressed. For example, the aspect ratio of the holes, or the hole diameter to length, and/or the geometry of the holes may be controlled so that the flow of ionically-charged species in the activated gas passing through the ion suppressor is reduced.

Turning to FIG. 5 is shown a simplified schematic of processing system 500 according to the present technology. The chamber of system 500 may include any of the components as previously discussed with relation to FIGS. 2-4, and may be configured to house a semiconductor substrate 555 in a processing region 533 of the chamber. The chamber housing 503 may at least partially define an interior region of the chamber. For example, the chamber housing 503 may include lid 502, and may at least partially include any of the other plates or components illustrated in the figure. For example, the chamber components may be included as a series of stacked components with each component at least partially defining a portion of chamber housing 503. The substrate 555 may be located on a pedestal 565 as shown. Processing chamber 500 may include a remote plasma unit (not shown) coupled with inlet 501. In other embodiments, the system may not include a remote plasma unit.

With or without a remote plasma unit, the system may be configured to receive precursors or other fluids through inlet 501, which may provide access to a mixing region 511 of the processing chamber. The mixing region 511 may be separate from and fluidly coupled with the processing region 533 of the chamber. The mixing region 511 may be at least partially defined by a top of the chamber of system 500, such as chamber lid 502 or lid assembly, which may include an inlet assembly for one or more precursors, and a distribution device, such as faceplate 509 below. Faceplate 509 may be similar to the showerhead or faceplate illustrated in FIG. 4 in disclosed embodiments. Faceplate 509 may include a plurality of channels or apertures 507 that may be positioned and/or shaped to affect the distribution and/or residence time of the precursors in the mixing region 511 before proceeding through the chamber.

For example, recombination may be affected or controlled by adjusting the number of apertures, size of the apertures, or configuration of apertures across the faceplate 509. Spacer 504, such as a ring of dielectric material may be positioned between the top of the chamber and the faceplate 509 to further define the mixing region 511. Additionally, spacer 504 may be metallic to allow electrical coupling of lid 502 and faceplate 509. Additionally, spacer 504 may not be included, and either lid 502 or faceplate 509 may be characterized by extensions or raised features to separate the two plates to define mixing region 511. As illustrated, faceplate 509 may be positioned between the mixing region 511 and the processing region 533 of the chamber, and the faceplate 509 may be configured to distribute one or more precursors through the chamber 500.

The chamber of system 500 may include one or more of a series of components that may optionally be included in disclosed embodiments. For example although faceplate 509 is described, in some embodiments the chamber may not include such a faceplate. In disclosed embodiments, the precursors that are at least partially mixed in mixing region 511 may be directed through the chamber via one or more of the operating pressure of the system, the arrangement of the chamber components, or the flow profile of the precursors.

An additional plate or device 523 may be disposed below the faceplate 509. Plate 523 may include a similar design as faceplate 509, and may have a similar arrangement as is illustrated at FIG. 4, for example. Spacer 510 may be positioned between the faceplate 509 and plate 523, and may include a dielectric material, but may also include a conductive material allowing faceplate 509 and plate 523 to be electrically coupled in embodiments. Apertures 524 may be defined in plate 523, and may be distributed and configured to affect the flow of ionic species through the plate 523. For example, the apertures 524 may be configured to at least partially suppress the flow of ionic species directed toward the processing region 533, and may allow plate 523 to operate as an ion suppressor as previously described. The apertures 524 may have a variety of shapes including channels as previously discussed, and may include a tapered portion extending outward away from the processing region 533 in disclosed embodiments.

The chamber of system 500 optionally may further include a gas distribution assembly 525 within the chamber. The gas distribution assembly 525, which may be similar in aspects to the dual-channel showerheads as previously described, may be located within the chamber above the processing region 533, such as between the processing region 533 and the lid 502. The gas distribution assembly 525 may be configured to deliver both a first and a second precursor into the processing region 533 of the chamber. In embodiments, the gas distribution assembly 525 may at least partially divide the interior region of the chamber into a remote region and a processing region in which substrate 555 is positioned. Although the exemplary system of FIG. 5 includes a dual-channel showerhead, it is understood that alternative distribution assemblies may be utilized that maintain a precursor fluidly isolated from species introduced through inlet 501. For example, a perforated plate and tubes underneath the plate may be utilized, although other configurations may operate with reduced efficiency or not provide as uniform processing as the dual-channel showerhead as described. By utilizing one of the disclosed designs, a precursor may be introduced into the processing region 533 that is not previously excited by a plasma prior to entering the processing region 533, or may be introduced to avoid contacting an additional precursor with which it may react. Although not shown, an additional spacer may be positioned between the plate 523 and the showerhead 525, such as an annular spacer, to isolate the plates from one another. In embodiments in which an additional precursor may not be included, the gas distribution assembly 525 may have a design similar to any of the previously described components, and may include characteristics similar to the faceplate illustrated in FIG. 4.

In embodiments, gas distribution assembly 525 may include an embedded heater 529, which may include a resistive heater or a temperature controlled fluid, for example. The gas distribution assembly 525 may include an upper plate and a lower plate. The plates may be coupled with one another to define a volume 527 between the plates. The coupling of the plates may be such as to provide first fluid channels 540 through the upper and lower plates, and second fluid channels 545 through the lower plate. The formed channels may be configured to provide fluid access from the volume 527 through the lower plate, and the first fluid channels 540 may be fluidly isolated from the volume 527 between the plates and the second fluid channels 545. The volume 527 may be fluidly accessible through a side of the gas distribution assembly 525, such as channel 223 as previously discussed. The channel may be coupled with an access in the chamber separate from the inlet 501 of the chamber 500. The chamber of system 500 may also include a chamber liner 535, which may protect the walls of the chamber from plasma effluents as well as material deposition, for example. The liner may be or may include a conductive material, and in embodiments may be or include an insulative material.

In some embodiments, a plasma as described earlier may be formed in a region of the chamber defined between two or more of the components previously discussed. For example, a plasma region such as a first plasma region 515, may be formed between faceplate 509 and plate 523. Spacer 510 may maintain the two devices electrically isolated from one another in order to allow a plasma field to be formed. Faceplate 509 may be electrically charged while plate 523 may be grounded or DC biased to produce a plasma field within the region defined between the plates. The plates may additionally be coated or seasoned in order to minimize the degradation of the components between which the plasma may be formed. The plates may additionally include compositions that may be less likely to degrade or be affected including ceramics, metal oxides, or other conductive materials.

Operating a conventional capacitively-coupled plasma (“CCP”) may degrade the chamber components, which may remove particles that may be inadvertently distributed on a substrate. Such particles may affect performance of devices formed from these substrates due to the metal particles that may provide short-circuiting across semiconductor substrates. However, the CCP of the disclosed technology may be operated at reduced or substantially reduced power in embodiments, and may be utilized to maintain the plasma, instead of ionizing species within the plasma region. In other embodiments the CCP may be operated to ionize precursors delivered into the region. For example, the CCP may be operated at a power level below or about 1 kW, 500 W, 250 W, 100 W, 50 W, 20 W, etc. or less. Moreover, the CCP may produce a flat plasma profile which may provide a uniform plasma distribution within the space. As such, a more uniform flow of plasma effluents may be delivered downstream to the processing region of the chamber.

The chamber of system 500 may also include an additional plasma source within the chamber housing. For example, plasma source 550 may be an inductively-coupled plasma (“ICP”) source in embodiments. As illustrated, the ICP source 550 may be included between the gas distribution assembly 525 and the pedestal 565. The ICP source 550 may be positioned above the processing region 533, and may at least partially define the processing region 533 from above. The ICP source may include a combination of materials in embodiments, or may be a single material design. As a combination, ICP source 550 may include a conductive material 554 that is included within a dielectric material 552, or contained or housed within the dielectric material 552. In embodiments the dielectric material 552 may include any number of dielectric or insulative materials. For example, dielectric material 552 may be or include aluminum oxide, yttrium oxide, quartz, single crystalline silicon, or any other insulating material that may function within the processing environment. Some materials may not operate effectively as the dielectric material 552 in embodiments in which the ICP source 550 is positioned near or partially defining the processing region. Because the ICP source 550 may be exposed to one or more precursors or plasma effluents, the choice of material for the dielectric material 552 may be related to the precursors or operations to which it will be exposed.

The conductive material 554 may be any conductive material that may carry current. Conductive material 554 may include a solid material or a hollow material, such as a tube. By utilizing a tube, for example, a fluid may be flowed through the hollow structure, which may aid in cooling of the source under charge. In embodiments the conductive material 554 may be configured to receive a fluid flowed within the tube. The fluid may be water, for example, or may be any other fluid that may not impede the function of the ICP source 550 during operation. The conductive material 554 may be any conductive material that may operate effectively at varying operating conditions. In one non-limiting example, the conductive material 554 may be copper, including a copper tube, although other conductive materials such as other metals, or conductive non-metals may be used. Conductive material 554 may be included in a number of configurations as will be discussed below. In some configurations, the conductive material may be a tube, which may be wound, spiraled, or coiled within the dielectric material 552, and thus may be located throughout the dielectric material 552, including at optional locations 558, for example. The conductive material 554 may be included in a relatively uniform or uniform configuration to produce a uniform plasma across the ICP source 550, for example.

As previously noted, ICP source 550 may be positioned below the fluid delivery sources, such as gas distribution assembly 525 as well as other diffusers, faceplates, or showerheads previously discussed. When positioned above processing region 533, or proximate wafer 555, a uniform flow of materials through ICP source 550 may be desired to provide a uniform process across wafer 555. Thus, gas that has been distributed through the chamber through other showerheads may be a relatively uniform distribution upon interacting with the ICP source 550. Accordingly, ICP source 550 may operate as a showerhead or even as a final distributor before delivery into the processing region for contact with the wafer 555. ICP source 550 may be configured to maintain a uniform or relatively uniform flow of precursors and/or plasma effluents through the chamber and into the processing region 533. Embodiments of ICP sources 550 may include apertures 556 defined in the dielectric material 552 and through the ICP source 550. Several exemplary configurations are discussed in detail below. The apertures may be spaced apart from or around the conductive material 554 contained within the dielectric material 552. In some embodiments the direction of the apertures 556 may be perpendicular to the direction of the conductive material 554 within the dielectric material 552. For example, a central axis of any one or more of the apertures 556 may be normal to an axis of the conductive material 554, such as at an entrance to the ICP source 550, or to the direction of fluid flow within the conductive material 554, or to a direction of a channel defined in the dielectric material 552 in which the conductive material 554 may be seated.

A distance between ICP source 550 and gas distribution assembly 525 may be maintained to prevent or reduce a plasma from generating between the two components. The gas distribution assembly 525 may be grounded in some embodiments, and thus with a charged ICP source 550, the gas distribution assembly 525 may cause electromagnetic losses from the ICP source 550. Accordingly, a farther distance between the two components may be desired. However, as the components are spaced further apart, it may be possible to strike a plasma within the region between the two components. Accordingly, a distance between the two components may be less than or about 1 inch in embodiments to avoid striking a plasma between the two components. In some embodiments, the distance between the two components may be less than or about 0.9 inches, less than or about 0.8 inches, less than or about 0.7 inches, less than or about 0.6 inches, less than or about 0.5 inches, less than or about 0.4 inches, less than or about 0.3 inches, less than or about 0.2 inches, less than or about 0.1 inches, or less, although a distance may be maintained between the two components to ensure uniformity of flow between the two components which may have apertures that are axially aligned, or may be specifically offset from each other.

By including an ICP source 550, such as illustrated, a lower voltage may be produced than with a capacitively coupled plasma. In a capacitively-coupled plasma, the voltage induced on the electrodes may be directly proportional to the power, and thus may generate high voltages even at reduced power. For example, an exemplary capacitive source may be operated at a relatively low power level of about 50 W and at a pressure of about 20 mTorr, but may induce a voltage of 300-400 volts on the plates of the capacitive source. This may produce the sputtering previously discussed, for example. An inductively-coupled plasma source operated at the same frequency, such as ICP source 550, for example, may produce an induced voltage less than 300 volts for example, and may be less than 250 volts, less than 200 volts, less than 175 volts, less than 150 volts, less than 125 volts, less than 100 volts, less than 90 volts, less than 80 volts, less than 70 volts, less than 60 volts, less than 50 volts, or less depending on the number of turns and other parameters.

Additionally, utilizing ICP source 550 may provide an additional advantage over a capacitively-coupled source as discussed previously with respect to FIG. 2. FIG. 2 showed an exemplary chamber design according to the present technology in which a capacitively-coupled plasma was produced in region 270. A capacitively coupled plasma may utilize two electrodes, which can include, for example a showerhead as well as the wafer pedestal. Thus, ion density and ion energy at the wafer level are determined together. With an ICP source, the ion energy at the wafer level may be decoupled from the ion density of the plasma. For example, an ICP source may utilize an antenna to ionize gas, and may determine the ion density, which may be a function of power. Accordingly, an ICP source at a particular power may define the ion density of the plasma produced. The system, however, may still include the RF electrode in the pedestal, and may utilize a ground source, such as chamber walls. By utilizing an RF electrode and electrical ground separate from the antenna defining the ion density, the ion energy may be controlled separately at the wafer level by this RF bias at the wafer level. Accordingly, embodiments of the present design may provide additional control and tuning over process activities by utilizing the ICP source to determine ion density of the plasma, and then using an RF bias at the wafer or pedestal to control ion energy. Accordingly, the present system may produce a high density plasma, and also provide a low energy at the wafer level, for example, to perform intricate wafer modifications and ion etching.

Turning to FIG. 6 is shown a plan view of an exemplary ICP source 600 according to embodiments of the present technology. As illustrated, ICP source 600 may be or include a planar source in which a conductive material 610 is configured in a two-dimensional pattern, or substantially two-dimensional pattern, within a dielectric material 620. Conductive material 610 may enter dielectric material 620 at an exterior region of the dielectric material 620. Conductive material 610 may follow a pattern based on a channel at least partially defined within or across a surface of the dielectric material 620. As illustrated, conductive material 610 may be configured in a planar coiled or spiral pattern within the dielectric material 620. ICP source 600 may include any of the materials previously described and may be incorporated in any of the exemplary chambers discussed previously or elsewhere in the disclosure.

The spiral may be included to provide a number of turns of the conductive material 610. For example, in exemplary configurations the spiral may include at least about 1 turn, and may include at least or about 2 turns, at least or about 3 turns, at least or about 4 turns, at least or about 5 turns, at least or about 6 turns, at least or about 7 turns, at least or about 8 turns or more turns depending, for example, on the size of the conductive material or dielectric material. Additionally, exemplary ICP sources may include between about 1 turn of the conductive material and about 7 turns of the conductive material, or between about 2 turns and about 4 turns. Portion 610 a of conductive material 610 may extend vertically within the dielectric material 620, and may extend normal to the planar coil or spiral configuration of conductive material 610. As will be explained below, portion 610 a may still be contained within the dielectric material 620 in embodiments.

The number of turns of the conductive material 610 or ICP coil may impact the power provided by the ICP source. For example, a higher number of turns of the conductive material may provide an increased power to the plasma. However, as the number of turns continues to increase, this advantage may begin to decrease. For example, as turns continue to increase, the coil may begin to compensate and induce a self-inductance, or effectively resisting itself. Accordingly, by reducing the turns below such a threshold, or minimizing the effect, as well as providing enough turns for adequate power, a balance may be established to provide acceptable ICP sources. Additionally, the configuration of the conductive material 610 may be to include similar coverage across the dielectric material 620 to provide a more uniform plasma profile through the ICP source.

ICP source 600 may also include apertures 630 defined through dielectric material 620 as previously described. The apertures may be configured to develop uniformity of a flow profile through the ICP source. In some embodiments the apertures 630 may be included in a uniform pattern across the dielectric material 620 and about the conductive material 610. As illustrated, apertures 630 are included in a spiral or coiled pattern similar to conductive material 610. Because the apertures 630 may perforate the dielectric material 620 to provide flow channels, the apertures may not be positioned in line with the conductive material. Although illustrated in a spiral pattern, the apertures may be included in additional or alternative configurations that may include a goal of providing a substantially uniform flow profile through the ICP source.

Additionally, the number of apertures 630 may be variable, and may not be adequately represented by the figure, which is included more for the pattern of apertures. The number of apertures in any pattern across the ICP source 600 may be greater than or equal to 10 apertures, greater than or equal to 50 apertures, greater than or equal to 100 apertures, greater than or equal to 500 apertures, greater than or equal to 1,000 apertures, greater than or equal to 5,000 apertures, greater than or equal to 10,000 apertures, or more depending on the size of ICP source 600 and the dimensions of the apertures. The number of apertures may also be any smaller range within these ranges, or between any two numbers included within these ranges. Similarly, the dimensions and geometries of the apertures may be similar across the ICP source 600, or may be different between apertures.

FIG. 7 shows a cross-sectional view of the exemplary ICP source 600 of FIG. 6 according to embodiments of the present technology. As illustrated, ICP source 600 may include a conductive material 610 included within a dielectric material 620. Dielectric material 620 may also define apertures 630 through the ICP source 600, and the apertures may be positioned around or about the conductive material 610. As illustrated, the cross-sectional view shows an embodiment of conductive material 610 as it both enters and exits dielectric material 620. The conductive material 610 may be coupled with a power source, such as RF power source 710 at one end of the conductive material, such as a copper tube. Additionally, the end of conductive material 610 exiting the dielectric material 620 may be coupled with electrical ground 720. In other embodiments, the conductive material 610 may include multiple sections. In order to include the conductive material 610, FIG. 7 illustrates that ICP source 600 may be thicker than one inch in embodiments, and may be between about 0.5 inches and about 3 inches in embodiments, or between about 1 inch and about 2 inches in embodiments.

FIG. 7 shows an additional view of conductive material portion 610 a, which may extend normal to the coiled configuration of conductive material. As illustrated, portion 610 a of conductive material may extend vertically and then exit the dielectric material 620 with section 610 b. Section 610 b is illustrated as hidden, as it may not be in line with the portion entering the dielectric material 620, and may not intersect any of apertures 630. As illustrated, the conductive material 610 may be completely enclosed within the dielectric material 620, except for stub portions extending from the chamber in which the source may be located and may be coupled with electrical sources. To incorporate the conductive material 610 within the dielectric material 620, the dielectric material may be cast about the conductive material, for example.

In another embodiment, the dielectric material may include a plurality of plates that each may include a portion of conductive material 610. For example, the dielectric material may include at least two plates coupled together, such as is illustrated with optional plate divisions 640, 650. As illustrated, the ICP source includes 3 plates, although additional sources may include 1 or 2 plates as well as more than 3 plates, for example. Each plate of dielectric material 620 may define at least a portion of a channel in which the conductive material may be seated in embodiments. The conductive material may then be positioned or seated within at least one plate, and then a second or additional plates may be coupled with the first plate to enclose or house the conductive material within the dielectric material 620 plates, and within the channel at least partially defined by each of the plates. Although illustrated as having the planar configuration of the conductive material within a lower plate or at a lower portion of dielectric material 620, it is to be understood that the configuration can be reversed, with the coil pattern at an upper portion of the dielectric material, and the portion 610 a extending vertically down from the coiled portion before exiting the dielectric material 620.

FIG. 8 shows a plan view of another exemplary plasma source 800 according to embodiments of the present technology. Plasma source 800 may include some or all of the components or characteristics previously discussed. As illustrated, plasma source 800 may include a conductive material 810 included in dielectric or insulative material 820, as previously described. Plasma source 800 may include any of the materials or configurations previously described and may be incorporated in any of the exemplary chambers discussed previously or elsewhere in this disclosure. Dielectric material 820 may additionally define a number of apertures 830 through plasma source 800, which may be positioned about or around the conductive material 810. The aperture configuration is only exemplary, and adjustments with the number, size, shape, and location of apertures will be understood to be encompassed as well. The conductive material 810 may be in a fully planar configuration as illustrated in FIG. 8, and may not include a portion extending above or below the planar configuration as was illustrated, for example, in FIGS. 6-7. In some embodiments, the dielectric material 820 may also include two dielectric plates coupled with one another that each define at least a portion of a channel in which the conductive material may be seated.

FIG. 9 shows a plan view of another exemplary plasma source 900 according to embodiments of the present technology. Plasma source 900 may include any of the materials or configurations previously described and may be incorporated in any of the exemplary chambers discussed previously or elsewhere in this disclosure. Plasma source 900 may include two conductive materials, such as conductive tubes, positioned within the plasma source. As illustrated, plasma source 900 may include two conductive materials 910, 940 included within dielectric material 920. The configuration may include a first tube 910 disposed in a first configuration within dielectric material 920. Additionally, plasma source 900 may include a second tube 940 disposed in a second configuration within dielectric material 920. The second configuration, which may include the looped portion of second tube 940, may be radially inward of the first configuration, or coiled portion, of conductive tube 910 within the dielectric material 920, or within the plasma source 900. Plasma source 900 may also include apertures 930 defined within the dielectric material 920. Apertures 930 may include any pattern as previously discussed, and may include differently sized apertures, such as smaller apertures 930 a and larger apertures 930 b distributed across the plasma source 900. The configuration may allow improvements in uniformity of delivery of precursors through the plasma source 900, for example.

As illustrated, the first tube 910 and the second tube 940, as well as the first configuration and the second configuration of the tubes or other conductive material, may be planar configurations. In embodiments, the first configuration and the second configuration may be within the same plane across dielectric material 920. Accordingly, the dielectric material may define at least a portion of a first channel and at least a portion of a second channel in which the two conductive materials may be seated. In other embodiments, the first configuration or first tube 910 may be on different plane of dielectric material 920 than the second configuration or second tube 940. For example, first tube 910 may be disposed vertically offset within dielectric material 920 from second tube 940.

When vertically offset, for example, the dielectric material may include three plates that each define at least a portion of a channel in which either first tube 910 or second tube 940 may be seated. A middle plate, for example, may define at least a portion of a channel in which first tube 910 is seated on a first surface of the middle plate. Additionally, the middle plate may define at least a portion of a channel in which second tube 940 is seated on a second surface of the middle plate that may be opposite the first surface. In embodiments, the first tube 910 may be covered by a first portion of dielectric material 920, and the second tube 940 may be covered by a second portion of dielectric material 920. The two portions of dielectric material may then be coupled with one another to provide the plasma source 900. In this example or any example discussed throughout the disclosure in which multiple plates may be utilized for the plasma source, the apertures may be at least partially defined through each plate of dielectric material. When coupled together, the apertures may be axially aligned.

In exemplary configurations in which two separate conductive materials or tubes are included within a dielectric material, such as with first tube 910 and second tube 940 of plasma source 900, the two materials may be individually coupled with power supplies. For example, first tube 910 may be coupled with a first RF source, and second tube 940 may be coupled with a second RF source. Additionally, the two tubes may be coupled to an RF source together. In some embodiments, the first tube and second tube may be coupled to an RF source through a capacitive divider. A capacitive divider may allow management of the ratio of energy delivered to the plasma between the two tubes by adjusting the power delivered to each of the tubes. This may allow control of the plasma density distribution. For example, tunable capacitance may allow distributions of power of 50%/50%, 40%/60%, 30%/70%, 20%/80% between the two coils, which may also then be reversed between the two coils, or any other distribution of power as would be understood to be encompassed by this configuration. Generally, whether coupled with separate RF sources operating at similar or different power levels, or an RF power with a capacitive divider, utilizing two coils may allow tuning of the plasma to adjust for uniformity of treatment operations and plasma distribution.

Turning to FIG. 10 is shown a cross-sectional view of a processing chamber 1000 according to embodiments of the present technology. Chamber 1000 may include some or all of the components, materials, or configurations of chamber 200 and/or the chamber of system 500 discussed previously. For example, chamber 1000 may include a lid 1002 including an inlet 1001. Chamber 1000 may define an interior region that may be partitioned by one or more components within the chamber, such as to provide processing region 1033 in which a substrate 1055 may be positioned on a pedestal 1065. Processing region 1033 may include a liner 1035 such as previously discussed. Chamber 1000 may include a faceplate 1009 defining apertures 1007. Faceplate 1009 and lid 1002 may define a mixing region 1011 in which one or more precursors delivered to the chamber may be incorporated. Chamber 1000 may also include plate 1023 defining apertures 1024. In embodiments plate 1023 may be configured as an ion suppressor as previously discussed. A dielectric spacer 1010 may be positioned between faceplate 1009 and plate 1023. RF power may be coupled or coupleable with faceplate 1009, while plate 1023 may be coupled or coupleable with electrical ground. In embodiments, such a configuration may allow a capacitively-coupled plasma to be produced between the faceplate 1009 and the plate 1023 in region 1015.

Chamber 1000 may also include a showerhead or gas distribution assembly 1025. Gas distribution assembly 1025 may include an upper plate and a lower plate, which may be coupled with one another to define a volume 1027 between the plates. The coupling of the plates may be such as to provide first fluid channels 1040 through the upper and lower plates, and second fluid channels 1045 through the lower plate. The formed channels may be configured to provide fluid access from the volume 1027 through the lower plate, and the first fluid channels 1040 may be fluidly isolated from the volume 1027 between the plates and the second fluid channels 1045. In embodiments, gas distribution assembly 1025 may also include an embedded heater or heating element 1029.

Chamber 1000 may also include an additional plasma source, such as an inductively-coupled plasma (“ICP”) source 1050. ICP source 1050 may include any of the features or characteristics of other plasma sources described elsewhere in this description. ICP source 1050 may also operate similarly to any of the previously discussed plasma sources. ICP source 1050 may include a dielectric material 1052 through which apertures 1056 may be defined. ICP source 1050 may also include a first conductive material 1054 and a second conductive material 1058 included within the dielectric material 1052. The first conductive material 1054 and second conductive material 1058 may be electrically coupled with RF power in any of the configurations discussed previously including separate sources or a single source. The arrangement of apertures 1056 about the conductive materials 1058 may be any of the configurations as previously discussed, or any other arrangement around the conductive materials. ICP source 1050 may differ from some of the planar sources previously described in that ICP source 1050 may include coiled or otherwise configured conductive material that may extend vertically within the dielectric material 1052. An exemplary configuration of an ICP source 1050 is included below with respect to FIG. 11, and will be discussed further with that figure.

FIG. 11 shows a plan view of an exemplary plasma source 1100 according to embodiments of the present technology. As illustrated, plasma source 1100 may include a design having some similar features of any of the previously discussed designs, including FIG. 9 discussed above. Plasma source 1100 may include a first conductive material 1110 included within dielectric material 1120. Plasma source 1100 may also include a second conductive material 1140 included within dielectric material 1120. Plasma source 1100 may also include apertures 1130 defined throughout the source, which may include a variety of patterns and hole geometries to provide a uniform flow, or a relatively or substantially uniform flow of precursors or plasma effluents through plasma source 1100.

First and second conductive materials 1110, 1140 may be included in a coiled or spiraled configuration within dielectric material 1120. The coils may extend vertically within dielectric material 1120 without intersecting one another. For example, the coiled configuration of second conductive material 1140 may be radially inward of the coiled configuration of first conductive material 1110. The coils may each extend vertically in a circular fashion or in some other curved geometry for a number of turns. For example, first conductive material 1110 or second conductive material 1140 may each include at least about 1 complete turn, as well as at least about 2 complete turns, at least about 3 complete turns, at least about 4 complete turns, between about 2 complete turns and about 4 complete turns, or any other number of turns based on the spatial characteristics of the dielectric material and conductive material of the plasma source 1100.

In some embodiments the first conductive material 1110 and the second conductive material 1140 may include or be characterized by the same number of turns. In some embodiments the first or second conductive materials may include a different number of turns from one another. Additionally, in some embodiments, the first conductive material 1110 may turn in the same direction as the second conductive material 1140, while in some embodiments the first conductive material 1110 and the second conductive material 1140 may turn in opposite directions from one another, such as a left-hand turn and a right-hand turn. By having additional turns compared to some planar configurations, plasma source 1100 may provide additional plasma uniformity while providing the plasma tuning of two coils.

FIG. 12 shows a cross-sectional view of the exemplary plasma source of FIG. 11 according to embodiments of the present technology. As illustrated, plasma source 1100 may include a dielectric material 1120, which may include or encompass first conductive material 1110 and second conductive material 1140. Dielectric material 1120 may include any number of plates that may each define at least a portion of a channel within which first conductive material 1110 or second conductive material 1140 may reside. The dielectric material, which may include plates, may include any configuration previously described, or may be configured in additional variations that encompasses the conductive materials. Depending on the number of turns of each conductive material, plasma source 1100 may be of a thickness of at least about 2 inches in embodiments to cover the conductive materials, and may be at least about 3 inches, at least about 4 inches, at least about 5 inches, or greater in embodiments.

Conductive material 1110 and conductive material 1140 are each shown to include 4 coils extending vertically within the dielectric material 1120. The coils may be packed at any distance from adjacent coils depending on the number of coils made, the thickness of the conductive material, and the thickness of the dielectric material 1120. As illustrated, first conductive material 1110 may include end portion 1112 shown hidden, and second conductive material 1140 may include end portion 1142 shown hidden. The configuration or outlay of the tubes that may be the conductive materials may be horizontally disposed as illustrated. Because of the vertical extension of the conductive materials, in embodiments the first conductive material 1110 and/or the second conductive material 1140 may also be vertically aligned at the entrance and exit of the dielectric material 1120. Additionally, the coils of first conductive material 1110 may be spaced to allow the ingress and egress of second conductive material 1140 between the coils. As illustrated, leads or inlet and exit portions of second conductive material 1140 may pass within the coils of first conductive material 1110 without the conductive materials intersecting. The coiled configuration of second conductive material 1140 may then extend within the interior or radially inward of the coiled configuration of first conductive material 1110.

FIG. 12 additionally illustrates some apertures 1130 as may be included in cross section. For example, apertures 1130 a may be centrally located within plasma source 1100, while apertures 1130 b and 1130 c may be radially outward from a central region of the plasma source 1100. As previously discussed, the apertures 1130 may be of a variety of sizes and geometries to assist in uniformity of flow through the plasma source 1100.

The chambers and plasma sources described above may be used in one or more methods. FIG. 13 shows operations of an exemplary method 1300 according to embodiments of the present technology. The method may involve operations in an ion etching operation in which radical species may be directed to a surface of a wafer to etch or modify features on the wafer. Method 1300 may include flowing a precursor into a chamber at operation 1305. The chamber may be any of the chambers previously described, and may include one of the exemplary plasma sources, such as an ICP plasma source, as previously described. The precursor may be or include materials that may not chemically react with a surface of the wafer, and may include, for example, hydrogen, helium, argon, nitrogen, or some other precursor. The precursor may flow through the chamber to the plasma source, such as one of the ICP sources, at operation 1310. The plasma source may receive power to produce a plasma through the source, which may ionize the precursor at operation 1315 as the precursor flows through apertures defined in the source. The source may additionally operate as a showerhead to maintain or assist uniform flow of the precursor before it contacts the wafer.

In some embodiments a source, such as any of the ICP sources discussed, may also maintain plasma effluents produced elsewhere. For example, the plasma sources as described may be used to generate a plasma that may tune or further enhance plasma effluents produced in a capacitively-coupled plasma upstream of the source, or in an external source, such as a remote plasma unit. In this way precursors that may have relatively short residence times, for example, may be maintained by the ICP plasma of a source near a processing region or near the wafer level.

In the preceding description, for the purposes of explanation, numerous details have been set forth in order to provide an understanding of various embodiments of the present technology. It will be apparent to one skilled in the art, however, that certain embodiments may be practiced without some of these details, or with additional details.

Having disclosed several embodiments, it will be recognized by those of skill in the art that various modifications, alternative constructions, and equivalents may be used without departing from the spirit of the embodiments. Additionally, a number of well-known processes and elements have not been described in order to avoid unnecessarily obscuring the present technology. Accordingly, the above description should not be taken as limiting the scope of the technology.

Where a range of values is provided, it is understood that each intervening value, to the smallest fraction of the unit of the lower limit, unless the context clearly dictates otherwise, between the upper and lower limits of that range is also specifically disclosed. Any narrower range between any stated values or unstated intervening values in a stated range and any other stated or intervening value in that stated range is encompassed. The upper and lower limits of those smaller ranges may independently be included or excluded in the range, and each range where either, neither, or both limits are included in the smaller ranges is also encompassed within the technology, subject to any specifically excluded limit in the stated range. Where the stated range includes one or both of the limits, ranges excluding either or both of those included limits are also included.

As used herein and in the appended claims, the singular forms “a”, “an”, and “the” include plural references unless the context clearly dictates otherwise. Thus, for example, reference to “a layer” includes a plurality of such layers, and reference to “the precursor” includes reference to one or more precursors and equivalents thereof known to those skilled in the art, and so forth.

Also, the words “comprise(s)”, “comprising”, “contain(s)”, “containing”, “include(s)”, and “including”, when used in this specification and in the following claims, are intended to specify the presence of stated features, integers, components, or operations, but they do not preclude the presence or addition of one or more other features, integers, components, operations, acts, or groups. 

1. A semiconductor processing chamber comprising: a chamber housing at least partially defining a processing region of the semiconductor processing chamber; and an inductively coupled plasma source positioned within the chamber housing, wherein the inductively coupled plasma source comprises a conductive material within a dielectric material.
 2. The semiconductor processing chamber of claim 1, wherein the dielectric material is selected from the group consisting of aluminum oxide, yttrium oxide, single crystalline silicon, and quartz.
 3. The semiconductor processing chamber of claim 1, wherein the conductive material comprises a copper tube configured to receive a fluid flowed within the copper tube.
 4. The semiconductor processing chamber of claim 1, wherein the dielectric material defines apertures through the inductively coupled plasma source, and wherein the conductive material is positioned about the apertures within the dielectric material.
 5. The semiconductor processing chamber of claim 4, wherein the apertures are included in a uniform pattern across the dielectric material and about the conductive material.
 6. The semiconductor processing chamber of claim 1, wherein the conductive material is configured in a planar spiral pattern within the dielectric material.
 7. The semiconductor processing chamber of claim 1, wherein the conductive material is configured in a coil extending vertically within the dielectric material for at least two complete turns of the conductive material.
 8. The semiconductor processing chamber of claim 1, wherein the conductive material comprises two conductive tubes positioned within the inductively coupled source.
 9. The semiconductor processing chamber of claim 8, wherein a first tube is included in a first configuration within the inductively coupled source, wherein a second tube is included in a second configuration within the inductively coupled source, and wherein the second configuration is radially inward of the first configuration.
 10. The semiconductor processing chamber of claim 9, wherein the first configuration and the second configuration are each coiled configurations extending vertically within the dielectric material.
 11. The semiconductor processing chamber of claim 9, wherein the first configuration and the second configuration are each a planar configuration and are coplanar within the inductively coupled source.
 12. The semiconductor processing chamber of claim 9, wherein the first tube and the second tube are coupled with an RF source.
 13. The semiconductor processing chamber of claim 12, wherein the first tube and the second tube are each coupled with the RF source through a capacitive divider.
 14. The semiconductor processing chamber of claim 1, wherein the inductively coupled source comprises at least two plates coupled together, wherein each plate defines at least a portion of a channel, and wherein the conductive material is housed within the channel at least partially defined by each of the at least two plates.
 15. An inductively coupled plasma source comprising: a first plate defining at least a portion of a channel within the first plate, wherein the first plate comprises a dielectric material; and a conductive material seated within the at least a portion of the channel, wherein the conductive material is characterized by a spiral or coil configuration, and wherein the conductive material is coupled with an RF source.
 16. The inductively coupled plasma source of claim 15, wherein the first plate defines apertures through the first plate, and wherein a central axis of each aperture is normal to the at least a portion of the channel.
 17. The inductively coupled plasma source of claim 15, wherein the source comprises a thickness of at least three inches.
 18. The inductively coupled plasma source of claim 15, wherein the first plate defines at least a portion of the channel as a first channel and at least a portion of a second channel, and wherein the conductive material comprises at least a first conductive material seated within the at least a portion of the first channel and a second conductive material seated within the at least a portion of the second channel.
 19. The inductively coupled plasma source of claim 15, further comprising a second plate coupled with the first plate enclosing the conductive material between the first plate and the second plate, wherein the second plate defines second apertures axially aligned with first apertures defined through the first plate.
 20. A semiconductor processing chamber comprising: a chamber housing at least partially defining an interior region of the semiconductor processing chamber, wherein the chamber housing includes a lid assembly including an inlet for receiving precursors into the semiconductor processing chamber; a showerhead positioned within the chamber housing, wherein the showerhead at least partially defines a semiconductor processing region from above; and an inductively coupled plasma source positioned within the semiconductor processing region, wherein the inductively coupled plasma source comprises a conductive material within a dielectric material. 